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Stock Code:002962
CNEN
0716-88000025
Semiconductor Optical Products

Through - hole glass wafer

Technical Specifications
Spacer Product Size(大孔產(chǎn)品尺寸) 詳情
Material(材料) D263T、BF33 等
Thickness(厚度) D263T:0.2mm ≤ T ≤ 1mm
BF33:0.2mm ≤ T ≤3mm
Size of hole(孔徑范圍) 當 T ≤1mm 時,最小 40 μm
Through - hole taper(通孔錐度) ≤ 0° - 2°
Aspect ratio(最大深寬比) 最大 20:1
Through - hole size tolerance (upper and lower surfaces)(通孔尺寸公差(上下表面)) ±10μm
Roundness(圓度) ≤ 15 μm
Chipping(崩邊) 激光誘加工后無崩邊,刻蝕后崩邊 ≤ 10 μm
Position tolerance(位置度公差) 在 φ200mm 范圍內(nèi) ± 10 μm